1. What is Die Per Wafer (DPW)?

Die Per Wafer (DPW) is a calculation that estimates how many semiconductor dies (individual chips) can fit on a single wafer. It's a crucial metric in semiconductor manufacturing that affects production costs and yields.

2. How Does the Calculator Work?

The calculator uses the DPW formula:

Where:

• \( D \) — Wafer diameter (mm)
• \( A \) — Die area (mm²)

Explanation: The first term calculates how many dies would fit if the wafer was perfectly divisible, while the second term accounts for edge losses.

3. Importance of DPW Calculation

Details: Accurate DPW calculation helps semiconductor manufacturers estimate production capacity, calculate costs per die, and optimize wafer utilization.

4. Using the Calculator

Tips: Enter wafer diameter in millimeters and die area in square millimeters. Both values must be positive numbers.

5. Frequently Asked Questions (FAQ)

Q1: Does this account for wafer edge exclusion?
A: The basic formula doesn't account for edge exclusion zones. For precise calculations, subtract the edge exclusion from the effective wafer diameter.

Q2: How accurate is this estimation?
A: This provides a theoretical maximum. Actual yield may be lower due to defects, die placement constraints, and other factors.

Q3: What about rectangular dies?
A: The formula assumes square dies. For rectangular dies, use the die area but results may vary slightly.

Q4: Does this work for all wafer sizes?
A: Yes, as long as you input the correct diameter (typically 150mm, 200mm, or 300mm for modern wafers).

Q5: How does die size affect DPW?
A: Smaller dies yield more DPW, following roughly an inverse square relationship with die area.